Model Number: 1A1 Brand Name: RDW001-jiawei Key Specifications/Special Features: 1A1 resin bond diamond grinding wheelsResin binder has a great advantage, a good self-sharpening, sharp cutting, high grinding efficiency, good workpiece surface roughness , less heat, not easy to burn the workpiece, suitable for most workpiece materials efficiency, precision grinding and polishing.The main target: the industry for LED sapphire wafer, the silicon wafer, GaAs, GaN wafer, glass and other products processing industry.Workpiece material: synthetic sapphire, silicon, polycrystalline silicon, gallium arsenide, gallium nitride and other materials.Widely used in coarse grinding material, semi-fine grinding, precision polishing, cutting and more.Could offer various diamond grinding wheels: diameter range 6-900mm, work part thickness 1-400mm, grit range: 20/35-W0.5, and according to customer design and manufacture non-standard products. Shipping Information:

FOB Port: China (Mainland)

Lead Time: 7 - 15 days

Main Export Markets:

• Asia
• Australasia
• Central/South America
• Eastern Europe
• Mid East/Africa
• North America
• Western Europe